Luvocom-News

We are at MECSPE!

We are excited to announce our participation in the MECSPE fair (Bologna 6-8 March) and can't wait to show what we have prepared.

In our stand in Piazza TMP (hall 36) we will have the pleasure of presenting materials and technologies for uncompromising, efficient and sustainable applications. From the complexity of shapes to the most demanding challenges, we will be at the fair to show that there are no limits when it comes to innovation and creativity. Join us to discover how LEHVOSS materials can transform your industry and open up new opportunities for your business.